| 摘要 |
PROBLEM TO BE SOLVED: To provide an easier pattern forming method for manufacture of a semiconductor device etc. SOLUTION: The pattern forming method includes the steps of: coating a substrate with a polymer copolymer having a first segment and a second segment; bringing a template having a recess into contact with the polymer copolymer and filling the recess of the template with the polymer copolymer; phase-separating the filled polymer copolymer into a phase having the first segment and a phase having the second segment; releasing the template from the polymer copolymer; and removing the phase having the first segment or the phase having the second segment of the polymer copolymer. COPYRIGHT: (C)2011,JPO&INPIT
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