| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer robot equipped with a wafer alignment/orientation flat alignment mechanism, having a simple structure using a mechanism and a control system inherent to a general wafer transfer robot without the need to provide a sensor unit mounting part, and to provide a substrate processing apparatus equipped with the wafer transfer robot. SOLUTION: The wafer transfer robot includes an orientation flat alignment mechanism for arranging a wafer setting part in a fixing manner above a first arm moving centered around a support extending from a drive mechanism of the wafer transfer robot, arranging a sensor on the first arm, performing sensing with the sensor after the sensor is aligned to the wafer by moving the wafer to a position above the sensor using a wafer chuck, placing the wafer on the setting part by moving the support up and down with the drive mechanism from the state described above, and aligning the orientation flat of the wafer by rotating the support by a predetermined angle. COPYRIGHT: (C)2011,JPO&INPIT
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