METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING STRUCTURES

摘要

In methods of manufacturing a semiconductor device, a plurality of gate structures spaced apart from each other and oxide layer patterns. A sputtering process using the oxide layer patterns as a sputtering target to connect the oxide layer patterns on the adjacent gate structures to each other is performed, so that a gap is formed between the gate structures. A volume of the gap is formed uniformly to have desired volume by controlling a thickness of the oxide layer patterns.