| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable semiconductor device. <P>SOLUTION: The semiconductor device includes a package body 1, a lead terminal partially covered with the package body 1. The lead terminal includes a first lead 3 having a semiconductor placing region and a second lead 4 having a wire connecting region to be connected with a conductive wired from a semiconductor element, arranged on both sides of an exposed part of the package body, wherein the first lead 3 has a corner 3a with a curve on a side of the second lead 4, semiconductor elements 2a, 2b are die-bonded to an inside of the corner 3a with a die bond agent, a first groove 7 and a second groove 8 are provided between a side constituting the corner 3a and the semiconductor elements 2a, 2b, respectively, and the first groove 7 and the second groove 8 are spaced at the corner 3a. <P>COPYRIGHT: (C)2011,JPO&INPIT |
