| 摘要 |
PROBLEM TO BE SOLVED: To form a build-up structure in a state wherein variances in cross-sectional areas and formation positions of contact parts for electrically connecting wiring patterns arranged in an insulated state with an insulating film interposed therebetween are suppressed. SOLUTION: The method of manufacturing the build-up substrate includes: a surface processing process S1 as a process of forming a wiring pattern of a first layer; a catalyst pattern forming process S2 of forming a catalyst pattern with an ink jet; a baking process S3 for the catalyst pattern; and an electroless copper plating process S4 of forming the wiring pattern. Further, the method of manufacturing the build-up substrate includes, as a process of forming a wiring pattern as a second layer and the contact part for electrically connecting the wiring patterns of the first layer and second layer, a liquid-repellent part forming process S5, an insulating film forming process S6, an insulating film surface processing process S7, a catalyst pattern forming process S8, a baking process S9 for the catalyst pattern, and an electroless copper plating process S10 of forming a wiring pattern and contact part. COPYRIGHT: (C)2011,JPO&INPIT |
