| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure of an IC card which never causes wrinkling on a surface of the IC card in thermal lamination and is also excellent in impact resistance. <P>SOLUTION: The IC card includes at least inner layer sheets 91, 92 and a facing sheet 3, which are laminated on an antenna substrate 10 of an inlet provided with an IC chip 5. The IC chip 5 includes reinforcing plates 61, 62 adhered to a chip mount area on a chip mount surface of the antenna substrate 10 where the IC chip 5 is electrically connected with the antenna and on the chip mount area on the surface facing the chip mount surface of the antenna substrate respectively through an adhesive resin. The reinforcing plate on the chip mount area side is covered with a cushioning resin 4 lower in elasticity than the inner layer sheets 91, 92 and facing sheet 3. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
