| 摘要 |
<p>The invention relates to a method of soldering a conducting body to a substrate using an alloy chosen from a tin-silver alloy and a tin-silver-copper alloy, characterized in that the method comprises the following steps: - metallization of the substrate, said metallization step comprising a step (6) of depositing a tie layer on the substrate and a step (10) of depositing a diffusion barrier layer, said tie layer having any one of the chemical components chosen from chromium, titanium and a titanium alloy, said diffusion barrier layer comprising a material chosen from platinum and palladium; and - depositing a wetting layer comprising gold; - application (18) of a solder between the conducting body and the metallized substrate, said solder comprising an alloy chosen from a tin-silver alloy and a tin-silver-copper alloy.</p> |
