| 摘要 |
<p>PURPOSE: A rapid conductive cooling using a secondary process step is provided to arrange active cooling region, including a cooling plate, to an opposite position of a heating area, to move the substrate between the cooling area and the heating area so that it makes it easy to control heating or cooling. CONSTITUTION: A processing chamber includes a non-contact or a magnetic floating type substrate support stand(104), a wall(108) and a chamber body(102). The wall forms an inner space(120). The chamber body has a floor(110) and an upper part(112). The wall includes a substrate access port(148) for promoting entrance or exit of the substrate. The substrate access port is connected to a transfer chamber or a rod lock chamber and can be selectively sealed by a slit valve. The substrate support stand has a ring shape. The chamber includes a radiating heat source(106) arranged at an inner diameter part of the substrate support stand.</p> |
