| 摘要 |
PURPOSE: A method for preventing plasma damage by wafer charge up is provided to prevent plasma damage by forging a buffer layer neutralizing charge transferred to the backside of a wafer. CONSTITUTION: In a method for preventing plasma damage by wafer charge up, an electrical buffer layer for re-distributed charges on a wafer backside is formed. The buffer neutralizes charges to prevent charge split. The electrical buffer layer makes positive charge implant. The electrical buffer layer is formed as a P-well.
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