METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE, AND MANUFACTURING SYSTEM OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To eliminate various kinds of adverse effects in a technique for forming a mark for recognizing position, on a chip. SOLUTION: This manufacturing method of a semiconductor device includes a process wherein a semiconductor wafer 1 mounted with a plurality of semiconductor chips 2 is held by a holding ring 4 via a dicing sheet 3 to dice the semiconductor wafer 1 by dicing. Further, the method includes a process wherein the mark for recognizing position (position-recognizing mark 5) is formed on the part positioned at the outside of the semiconductor wafer 1 in the dicing sheet 3. COPYRIGHT: (C)2011,JPO&INPIT