| 摘要 |
PURPOSE: An adhesive for a copper clad laminate is provided to ensure excellent adhesive strength, low surface illuminance, and excellent heat resistance by the heat of lead free and electronic products. CONSTITUTION: An adhesive for a copper clad laminate includes a thermoplastic resin and a thermosetting resin with strong high-temperature thermal resistance. The thermoplastic resin and thermosetting resin are mixed without phase separation. The glass transition temperature of the thermoplastic resin is 200°C or greater. The thermoplastic resin comprises at least one selected from PI, LCP, PTFE and rubber. The thermosetting resin is one selected from an epoxy resin, phenol resin, melanin resin, silicon resin, urethane resin and urea resin. |
