METHOD AND DEVICE FOR TREATING SUBSTRATES

摘要

In a method and a device for treating substrates, resist layers are removed from the substrate by spraying on a process solution. The process solution is first sprayed onto the substrate in a primary stripping module and then in a secondary stripping module, with the solution collecting in containers beneath the modules. Containers are provided for each module. The process solution is collected in the primary stripping module in two containers, and to this end is first directly conducted into a second container, which is largely separated from the first container by a wall, which is pervious to fluid in a region that is considerably below the surface level of the process solution. The process solution is withdrawn without foam from the first container and recirculated into the process cycle for wetting the substrates.