| 摘要 |
PURPOSE: A duplexer device and a manufacturing method thereof are provided to simplify a manufacturing process by removing an additional structure to protect a piezoelectric layer, an air gap, and a electrode layer inside a chip. CONSTITUTION: In a duplexer device and a manufacturing method thereof, a substrate(110) is comprised of a first layer(111), a second level(112), and a third layer(113). A circuit pattern formed in the first, second, and third layer is connected to each other through a via electrode. An elastic wave filter includes substrate(121,131), air gaps(122,132), and piezoelectric layers(123,133). Electrodes(124,134) are electrically connected to the piezoelectric layer. A molding unit(140) is coated on the top of the substrate in order to cover the elastic wave chip by using sealant.
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