发明名称 METHODS FOR FORMING SMALL-SCALE CAPACITOR STRUCTURES
摘要 The present disclosure provides small scale capacitors (e.g., DRAM capacitors) and methods of forming such capacitors. One exemplary implementation provides a method of fabricating a capacitor that includes sequentially forming a first electrode, a dielectric layer, and a second electrode. At least one of the electrodes may be formed by a) reacting two precursors to deposit a first conductive layer at a first deposition rate, and b) depositing a second conductive layer at a second, lower deposition rate by depositing a precursor layer of one precursor at least one monolayer thick and exposing that precursor layer to another precursor to form a nanolayer reaction product. The second conductive layer may be in contact with the dielectric layer and have a thickness of no greater than about 50 Å.
申请公布号 US2011163416(A1) 申请公布日期 2011.07.07
申请号 US201113047430 申请日期 2011.03.14
申请人 MICRON TECHNOLOGY, INC. 发明人 ZHENG LINGYI A.;DOAN TRUNG T.;BREINER LYLE D.;PING ER-XUAN;BEAMAN KEVIN L.;WEIMER RONALD A.;BASCERI CEM;KUBISTA DAVID J.
分类号 H01L29/92;G06F19/00;H01L21/02;H01L21/314;H01L21/8242 主分类号 H01L29/92
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