A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.
申请公布号
WO2011080672(A2)
申请公布日期
2011.07.07
申请号
WO2010IB56012
申请日期
2010.12.22
申请人
NXP B.V.;HOCHSTENBACH, HENDRIK PIETER;VON GEMERT, LEONARDUS ANTONIUS ELISABETH
发明人
HOCHSTENBACH, HENDRIK PIETER;VON GEMERT, LEONARDUS ANTONIUS ELISABETH