| 摘要 |
PURPOSE: A semiconductor device for minimizing a fuse crack is provided to minimize the defects of a fuse by securely operating a fuse through an electric path by a spare contact. CONSTITUTION: A fuse includes a first metal wire(22) and a second metal wire(25). The first metal wire and the second metal wire are connected through a fuse contact(24A) which passes through an interlayer dielectric layer(23). A protection layer(26) is formed on the upper side of the second metal wire. The fuse contact provides a first electric path between the first and second metal wires. A spare contact(24C) provides a second electric path between the first metal wire and the second metal wire.
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