| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device capable of grinding and polishing a large plate-like material in a reduced space. SOLUTION: Each of holding mechanisms 2a, 2b for holding workpieces has a first holding surface 21 holding a workpiece on one surface along the vertical direction, and a second holding surface 22 holding a workpiece on the other surface along the vertical direction. A grinding mechanism 3 includes a first grinding part 3a facing the first holding surface 21 and a second grinding part 3b facing the second holding surface 22. The workpieces are ground while rotating in a state where the workpiece held on the first holding surface 21 and the workpiece held on the second holding surface 22 are pressed against the first grinding part 3a and the second grinding part 3b, respectively, causing the workpieces to be sandwiched. Since the holding surfaces 21, 22 are made vertical, the device is prevented from being upsized accompanied by the workpiece, even if the workpiece is upsized, which suppresses the upsizing of the device. COPYRIGHT: (C)2011,JPO&INPIT |
