发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an in-line sputtering apparatus capable of executing the target cleaning before starting the production (film deposition) without using any dummy substrate, and enhancing the productivity. SOLUTION: In the in-line sputtering apparatus of the substrate passing type, a film deposition means is arranged in an exhaustable chamber 10 through which a substrate is passed, and at least one chamber is arranged in a communicating manner. A roll shutter 20 which is a blocking member to be wound is provided, which can be advanced/retracted between a conveying passage with the substrate being passed therethrough and the film deposition means in the chamber. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011132572(A) 申请公布日期 2011.07.07
申请号 JP20090293698 申请日期 2009.12.25
申请人 CANON ANELVA CORP 发明人 YAMADA TAMIO
分类号 C23C14/56 主分类号 C23C14/56
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