发明名称 ELECTRONIC PACKAGING
摘要 Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1): wherein R1 to R9 represent each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom, (B) a polyfunctional epoxy compound having a functional group number of two or more, and (C) an epoxy curing agent containing a phenolic hydroxyl group, wherein the proportion of the epoxy compound (A) is from 1 to 99% by weight based on the total weight of the epoxy compounds (A) and (B), whereas the epoxy resin composition contains a pyrogenically produced silica, which has been surface modified with Hexamethyldisilazane (HMDS) and structurally modified by a ball mill.
申请公布号 US2011163461(A1) 申请公布日期 2011.07.07
申请号 US20090992684 申请日期 2009.04.14
申请人 EVONIK DEGUSSA GMBH 发明人 NOWAK RUEDIGER;SCHLOSSER THOMAS;WARTUSCH REINER
分类号 H01L23/29;C08L63/00 主分类号 H01L23/29
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