发明名称 COPPER FOIL AND COPPER-CLAD LAMINATE PLATE USING SAME
摘要 <p>Disclosed are copper foil with excellent bending ability when used in a copper-clad laminate plate, and a copper-clad laminate using said copper foil. The copper foil is 5-30µm thick, has surface roughness of Ra?0.1µm in the direction parallel to the direction of rolling, and at 350°C has a work hardening exponent of 0.3 or greater and 0.45 or less 0.5 hours after annealing.</p>
申请公布号 WO2011081044(A1) 申请公布日期 2011.07.07
申请号 WO2010JP72852 申请日期 2010.12.20
申请人 JX NIPPON MINING & METALS CORPORATION;NAKAMURO KAICHIRO 发明人 NAKAMURO KAICHIRO
分类号 C22F1/00;C22F1/08;B21B3/00;C22C9/00;C22C9/02 主分类号 C22F1/00
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