PUSHER OF A CHEMICAL-MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A pusher of a chemical-mechanical polishing apparatus is provided to increase the yield of a wafer by preventing a wafer pusher from becoming damaged because of the wafer being wrongly mounted in a pusher due to the surface tension between the two. CONSTITUTION: In a pusher of a chemical-mechanical polishing apparatus, a liquid nozzle(110) and a gas injection nozzle(120) are formed around a pusher(100) alternately. The liquid nozzle is connected to a deionized water / liquid supply line(113) and discharges the deionized water / liquid. The deionized water / liquid supply line supply is connected to a hydrophilic deionized water supply unit(111) and a hydrophobic liquid supply unit(112). The gas injection nozzle is connected to a nitrogen supply line(122). The gas injection nozzle discharges nitrogen gas by controlling the valve of the nitrogen gas supply unit.