APPARATUS FOR FORMING SOLDER DAM AND METHOD OF FORMING SOLDER DAM

摘要

An apparatus for forming a solder dam on a lead of an electronic component is disclosed. The apparatus for forming a solder dam includes a wire material that transfers an ink that prevents adhesion of a solder to the lead; a wire material conveying device that conveys the wire material along a surface of the lead; and an ink supply device that supplies the ink to the wire material.