| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to improve the reliability of bump join by suppressing thermal and physical stress related to the bump of a flip chip package and a wafer-level package. CONSTITUTION: A semiconductor chip(310) includes a chip pad(312). A passivation layer(314) is stacked on the semiconductor chip excluding the chip pad. A first insulating layer is stacked on the passivation layer. A metal wiring layer(330) is stacked on the first insulating layer and in connection with the chip pad. A second insulating layer(340) is stacked on the metal wiring layer and includes an opening part. A metal layer(350) is stacked on the second insulating layer and is in connection with the metal wiring layer through the opening part. A ball pad(360) is stacked on the metal layer which is arranged on the opening part. A bump ball(370) is formed on the ball pad. |
