POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

摘要

PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film using the same, and a semiconductor device using the same are provided to obtain the superior quality of patterns without developing residues. CONSTITUTION: A positive type photo-sensitive resin composition includes a polybenzoxazol precursor, a photo-sensitive diazoquinone compound, a solubility controller, and a solvent. The polybenzoxazol precursor is represented by chemical formula 1. The solubility controller is the photoproducts of the diazoquinone compound. In the chemical formula 1, the X is an aromatic organic group. The Y is an aromatic organic group or an alicyclic organic group. The average molecular weight of the polybenzoxazole is between 3000 and 300000. The solubility controller is a carboxylic indene compound. The solvent is selected from a group including N-methy-2-pyrrolidone, γ-butyrolactone, N,N-dimethylacetamide, dimethyl sulfuroxide, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether, dipropylene glycol monmethyl ether, propylene glycol monomethyl ether acetate, methyllactate, ethyl lactate, butyl lactate, methyl-1,3-butylene glycol acetate, 1,3-butylene glycol-3-monomethyl, methyl pyruvate, ethyl pyruvate, methyl-3-methoxypropionate, and the combination of the same.