发明名称 Membrane attachment process by hot melting without adhesive
摘要 A method is provided for attaching a membrane (3) to a substrate by heat-bonding the membrane to the substrate (1). The substrate includes a top surface, a bottom surface and a receptacle (2) therethrough. The membrane can be a porous support structure combined with a polymeric gel. The method includes the steps of inserting a mandrel (4) into the receptacle, placing the membrane on the substrate across the receptacle, heating the membrane and substrate, and allowing the substrate to cool to provide heat-bonded interlock between the substrate and the membrane. <IMAGE>
申请公布号 EP1547690(B1) 申请公布日期 2011.07.06
申请号 EP20040029416 申请日期 2004.12.13
申请人 BECTON, DICKINSON AND COMPANY 发明人 HEATH, MICHAEL;PERREAULT, MARK
分类号 B01L3/00;G01N35/02;B01D29/00;B01D39/16;B01D65/00;B01J19/00;C40B60/14 主分类号 B01L3/00
代理机构 代理人
主权项
地址