发明名称 |
Membrane attachment process by hot melting without adhesive |
摘要 |
A method is provided for attaching a membrane (3) to a substrate by heat-bonding the membrane to the substrate (1). The substrate includes a top surface, a bottom surface and a receptacle (2) therethrough. The membrane can be a porous support structure combined with a polymeric gel. The method includes the steps of inserting a mandrel (4) into the receptacle, placing the membrane on the substrate across the receptacle, heating the membrane and substrate, and allowing the substrate to cool to provide heat-bonded interlock between the substrate and the membrane. <IMAGE> |
申请公布号 |
EP1547690(B1) |
申请公布日期 |
2011.07.06 |
申请号 |
EP20040029416 |
申请日期 |
2004.12.13 |
申请人 |
BECTON, DICKINSON AND COMPANY |
发明人 |
HEATH, MICHAEL;PERREAULT, MARK |
分类号 |
B01L3/00;G01N35/02;B01D29/00;B01D39/16;B01D65/00;B01J19/00;C40B60/14 |
主分类号 |
B01L3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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