MULTILAYER WIRING SUBSTRATE

摘要

PURPOSE: A multilayer wiring substrate is provided to charge a field via a conductor comprising an IC chip connection terminal within the opening formed in a resin dielectric layer, thereby securely preventing the detachment of the IC chip connection terminal by enhancing the adhesion of the resin dielectric layer and the IC chip connection terminal. CONSTITUTION: An wiring laminate portion(30) is formed by alternatively laminating a conductive layer(26) made of copper and four layers of a resin dielectric layer(21~24). An IC chip connection terminal(41) and a condenser connection terminal(42) are located on the upper side(31) of the wiring laminate portion. The IC chip connection terminal is arranged as an array shape in a chip mounted region which is formed at the substrate central part. A plurality of connection terminals(45) for LGA(Land Grid Array) is arranged in the lower part(32) of the wiring laminate portion. A via hole(33) and a field via conductor(34) are formed in the resin dielectric layer, respectively.