| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dielectric laminate structure having reduced damage of a dielectric layer, to provide a method of manufacturing a dielectric laminate structure capable of manufacturing such a dielectric laminate structure, and to provide a wiring board provided with such a dielectric laminate structure. <P>SOLUTION: A capacitor 1 is formed by baking a laminate 13 provided with a metal foil 2 having a through-hole 2a, a dielectric layer 11 formed on at least one of main surfaces 2b, 2c of the metal foil 2, and a conductor layer 12 formed on the dielectric layer 11. The through-hole 2a is formed before forming the dielectric layer 12 on at least one of the main surfaces 2b, 2c of the metal foil 2. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
