| 摘要 |
<p>An electronic device comprising a support plate together with a first and a second cover is provided. One or more electrical components are mounted on the support plate. The first cover is located on and connected to a first surface of the support plate. The first cover is configured and positioned to cover and thereby define a first sealed cavity over the, or each, respective component. The second cover is located on and connected to a second, opposing, surface of the support plate. The second cover is configured to define a second sealed cavity and is positioned to, at least partially, overlap a region of the support plate covered by the first cover.</p> |
