| 摘要 |
<p>A manufacturing line has a feeder (11) for feeding a hoop substrate (2), a bake oven (32) for heating and drying the fed hoop substrate (2), a die bonding device (34) for applying an adhesive to a predetermined position on the dried substrate (2) to mount an IC chip, and a cure oven (36) for bonding the IC chip to the hoop substrate (2) by heating and curing the adhesive.</p> |
