APPARATUS FOR REMOVING SOLDER BALL

摘要

PURPOSE: A solder ball removing apparatus is provided to constitute a high-quality circuit by simply removing a defective solder ball. CONSTITUTION: A solder ball removing apparatus(100) comprises a stage(110), a light source(130), and a nozzle(140). The stage supports a substrate(10) in which solder balls(11) are soldered. The light source melts defective solder balls by irradiating light to the defective solder balls. The nozzle eliminates the melted defective solder balls from the substrate. The nozzle comprises a main body, a transparent port, a blow port, and an exhaust port. A through hole is formed in the center of the main body. The transparent port inclinedly penetrates the main body. The blow port exhausted gas to the melted defective solder balls. The exhaust port is separated from the transparent port and the blow port and exhausts the defective solder balls to the outside.