LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light-emitting diode package is provided to improve durability for moisture permeability, by changing the design of a lead frame. CONSTITUTION: A second lead frame is electrically separated from a first lead frame(110). A package body(140) molds the first and the second lead frame. A cup part is formed in a part of the first lead frame. The cup part has a bottom, a side, an open top and a depth to accommodate a light emitting diode chip(200). A bending part is formed in one side of a part where the cup part is not formed. An outer bottom of the cup part is exposed to the outside through the bottom of the package body.