发明名称 METHOD AND DEVICE FOR CUTTING ADHESIVE FILM
摘要 <p>A device for ideal cutting of an adhesive film mother sheet which prevents displacement or peeling of a cover film, etc. on an adhesive layer when the adhesive film mother sheet deforms as a result of shearing forces that act during cutting. The cutting device 1 cuts the adhesive film mother sheet 2 into strips while performing conveyance thereof and includes a cutter mechanism 10 and heating mechanism (means) 3. The cutter mechanism 10 may includes an upper blade unit 11A wherein a plurality of upper blades 11 are arranged axially and a lower blade unit 12A wherein a plurality of lower blades 12 are arranged axially. The heating mechanism 3 is disposed upstream of the cutter mechanism 10 and may includes a blower 31, a heater 32, a temperature sensor 33, and a temperature control unit 34. The blower 31 may be connected to the heater 32 via a duct 35 and be disposed so as to blow heated air onto the adhesive film mother sheet 2.</p>
申请公布号 EP1731276(A4) 申请公布日期 2011.07.06
申请号 EP20050727639 申请日期 2005.04.01
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 KAWAI, TOMOHISA
分类号 B26D7/10;B26D1/24 主分类号 B26D7/10
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