SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS

摘要

PURPOSE: A substrate polishing apparatus, a substrate polishing method, an apparatus for adjusting temperature of polishing surfaces of a polishing pad used for a polishing apparatus are provided to shorten a polishing time by optimizing polishing surfaces of a substrate. CONSTITUTION: A polishing pad(11) is attached to a polishing table(13) and can be rotated. At least one substrate holder holds a substrate so as to polish the substrate and presses a polishing surface of the polishing pad on the polishing table for rotating the substrate. A pad temperature detector detects the temperature of the polishing surface of the polishing pad. A pad temperature controller(26) comes in contact with a polishing surface of the polishing pad so as to adjust the temperature of the polishing surface. A temperature controller controls the pad temperature controller and the temperature of the polishing surface of the polishing pad.