发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PURPOSE: A thermoplastic resin composition is provided to enable use for the injection of molded products of a thin film and a complex structure due to excellent flowage and to variously apply products requiring vehicles, electric and electronic products and industrial materials due to improved impact resistance. CONSTITUTION: A thermoplastic resin composition comprises 40-80 weight% of a polyamide resin and 20-60 weight% of a styrene-based resin and white oil, wherein a molar ratio of white oil and styrene resin is 40:60-70:30. The polyamide resin has a melting point of 215-275 °C. The styrene resin is a styrene-based block copolymer. The styrene-based block copolymer has 15-40 weight% of styrene content. The white oil has kinematic viscosity of 20-200 cSt.
申请公布号 KR20110076276(A) 申请公布日期 2011.07.06
申请号 KR20090132943 申请日期 2009.12.29
申请人 SAMYANG CORPORATION 发明人 KIM, SUN WOONG;KIM, MIN HYUNG;CHO, SUNG HWAN;KIM, DOE
分类号 C08L77/00;C08L25/04;C08L91/00 主分类号 C08L77/00
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