发明名称 |
THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION |
摘要 |
<p>A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula:—R2—SiR1a(OR3)(3-a) (wherein R1 designates the previously mentioned groups; R2 designates oxygen atoms or alkylene groups; R3 designates alkyl groups; and‘a’is an integer ranging from 0 to 2); and‘m’and‘n’are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.</p> |
申请公布号 |
EP2257616(B1) |
申请公布日期 |
2011.07.06 |
申请号 |
EP20090706173 |
申请日期 |
2009.01.22 |
申请人 |
DOW CORNING TORAY CO., LTD. |
发明人 |
NAKAYOSHI, KAZUMI;KATO, TOMOKO |
分类号 |
C10M169/02;C08L83/04;C08L83/14;C09K5/14;C10N30/00;C10N30/08;C10N40/14;C10N50/10;H01L23/373 |
主分类号 |
C10M169/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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