MULTI-LAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A multi-layer circuit board and a method of manufacturing the same are provided to improve heat dissipation perform by forming first and second insulating layers between a heat dissipation layer, a first circuit layer, and a second circuit layer. CONSTITUTION: In a multi-layer circuit board and a method of manufacturing the same, a first insulation layer(120) insulates the heat dissipation layer. A first circuit layer(130) forms a pattern on the first insulation layer. An adhesive layer(140) is formed around the pattern c of the first circuit layer. A conductive layer is formed on the pattern of the first circuit layer. A second insulation layer is formed around the conductive layer. A second circuit layer forms a pattern on the second insulation layer.