PURPOSE: An apparatus for regenerating a semiconductor wafer is provided to insert a wafer one by one by separating wafers to be regenerated from each other. CONSTITUTION: A semiconductor wafer reproduction device comprises a loading unit(30) for loading a wafer to be reproduced, a processing unit for regenerating a transferred wafer, and an unloading unit for unloading the wafer. The loading unit loads the wafer to be reproduced into the processing unit. The loading unit includes a sensor for detecting a size of the wafer. The processing unit transfers the loaded wafer. The processing unit includes a conveyor(40) which can partially change the damaged part. The processing unit includes an injection nozzle part.
申请公布号
KR20110075095(A)
申请公布日期
2011.07.06
申请号
KR20090131440
申请日期
2009.12.28
申请人
K.C.TECH CO., LTD.;SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, JONG SOO;LEE, KWANG HO;SUNG, WOO DONG;LEE, JONG GOO