发明名称
摘要 An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is large enough to cover a contact surface of the circuit chip. The elastic member does not overlap with an apex portion of the circuit chip, but overlaps with the circuit chip at an inner side of the apex portion. Therefore the elastic member does not press the FPC against the apex portion of the circuit chip. Accordingly, the FPC at a position corresponding to an apex of the circuit chip is suppressed from being distorted, and there is no fear of breaking of wire and exfoliation of the circuit chip.
申请公布号 JP4715798(B2) 申请公布日期 2011.07.06
申请号 JP20070102682 申请日期 2007.04.10
申请人 发明人
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
代理机构 代理人
主权项
地址