| 摘要 |
PURPOSE: A speed sensor is provided to improve reliability of a product by preventing damage and deformation due to the heat generated in an over-molding process as a second molding process of a terminal and a capacitor which are exposed to an outside of a mold frame. CONSTITUTION: A PCB and a terminal are molded in an inside of a mold frame(110) by performing a first molding process. A capacitor connected to the PCB is loaded in one side of the mold frame. A housing is molded on a periphery of the mold frame by performing a second molding process. A protection cover is used for protecting the terminal and the capacitor exposed to the outside of the mold frame in the second molding process. |
