MANUFACTURING METHOD FOR INTEGRATED SEMICONDUCTOR POWER MODULE SUBSTRATE

摘要

PURPOSE: A method for manufacturing an integrated power semiconductor module substrate is provided to simplify a structure and a manufacturing process of a power semiconductor module by integrating a metalized ceramic substrate on a metal base. CONSTITUTION: An insulating layer(303) is formed as an electrical insulating material on an upper surface of a metal base(301) which is loaded on one side of a power semiconductor module. An electrical conducting layer(305) is deposited as a thick film of an electrical conductive metal on an upper surface of the insulating layer. A solder layer is formed as an alloy material for soldering on an upper surface of an electrical conductive layer.