| 摘要 |
<p>The semiconductor device according to an aspect of the invention includes: an internal circuit area having an internal circuit; an I/O circuit area positioned outside the internal circuit area; and an electrode pad placed across an outer edge of the I/O circuit area. In the electrode pad, an area outside the outer edge of the I/O circuit area is a bonding area, and an area inside the outer edge is a probe area.</p> |
