发明名称 |
Printed circuit board coil |
摘要 |
A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly/downwardly, but also inwardly/outwardly in a regular, repeating pattern.
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申请公布号 |
US7973635(B2) |
申请公布日期 |
2011.07.05 |
申请号 |
US20080236832 |
申请日期 |
2008.09.24 |
申请人 |
ACCESS BUSINESS GROUP INTERNATIONAL LLC |
发明人 |
BAARMAN DAVID W.;SCHWANNECKE JOSHUA K.;GUTHRIE WARREN E.;WAHL RICHARD A.;DUCKWORTH PAUL |
分类号 |
H01F27/28;H01F5/00;H01F21/02;H01F27/29 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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