发明名称 THIN-FILM TRANSISTOR HAVING HIGH ADHESIVE STRENGTH BETWEEN BARRIER FILM AND DRAIN ELECTRODE AND SOURCE ELECTRODE FILMS
摘要 <p>This thin-film transistor includes adhesive strength enhancing films between a barrier film and electrode films. Each of the adhesive strength enhancing film is composed of two zones including (a) a pure copper zone that is formed on the electrode film side, and (b) a component concentrated zone that is formed in an interface portion contact with the barrier film, and that includes Cu, Ca, oxygen, and Si as constituents. In concentration distributions of Ca and oxygen in a thickness direction of the component concentrated zone, a maximum content of Ca of a Ca-containing peak is in a range of 5 to 20 at %, and a maximum content of oxygen of an oxygen-containing peak is in a range of 30 to 50 at %, respectively.</p>
申请公布号 KR20110074969(A) 申请公布日期 2011.07.05
申请号 KR20117002192 申请日期 2009.09.24
申请人 MITSUBISHI MATERIALS CORP.;ULVAC, INC. 发明人 MORI SATORU;KOMIYAMA SHOZO
分类号 H01L29/786;H01L21/28 主分类号 H01L29/786
代理机构 代理人
主权项
地址
您可能感兴趣的专利