发明名称 Method and apparatus for forming a high quality low temperature silicon nitride layer
摘要 A method of forming a silicon nitride layer is described. According to the present invention, a silicon nitride layer is deposited by thermally decomposing a silicon/nitrogen containing source gas or a silicon containing source gas and a nitrogen containing source gas at low deposition temperatures (e.g., less than 550° C.) to form a silicon nitride layer. The thermally deposited silicon nitride layer is then treated with hydrogen radicals to form a treated silicon nitride layer.
申请公布号 US7972663(B2) 申请公布日期 2011.07.05
申请号 US20030741417 申请日期 2003.12.19
申请人 APPLIED MATERIALS, INC. 发明人 WANG SHULIN;SANCHEZ ERROL ANTONIO C.;CHEN AIHUA (STEVEN)
分类号 H05H1/24;B05D3/00;C04B41/00;C08J7/18;C23C16/00;C23C16/34;C23C16/44;C23C16/452;C23C16/455;C23C16/56;H01L21/00;H01L21/30;H01L21/314;H01L21/318;H01L21/336;H05H1/00 主分类号 H05H1/24
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