发明名称 |
Vacuum hermetic organic packaging carrier and sensor device package |
摘要 |
A vacuum hermetic organic packaging carrier and a sensor device package are provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier. |
申请公布号 |
US7973454(B1) |
申请公布日期 |
2011.07.05 |
申请号 |
US20100850643 |
申请日期 |
2010.08.05 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHEN LUNG-TAI;HO TZONG-CHE;PAN LI-CHI;FAN YU-WEN |
分类号 |
H01L41/053 |
主分类号 |
H01L41/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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