发明名称 |
Thin film device having lead conductor film |
摘要 |
The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.
|
申请公布号 |
US7974042(B2) |
申请公布日期 |
2011.07.05 |
申请号 |
US20070736784 |
申请日期 |
2007.04.18 |
申请人 |
TDK CORPORATION |
发明人 |
MASUDA TAKAHIDE;SANO MASASHI;ARITOMO HIROKI |
分类号 |
G11B5/17;G11B5/48;G11B21/16 |
主分类号 |
G11B5/17 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|