BONDING PAD OF SEMICONDUCTOR CHIP FOR REDUCING DESTROYMENT

摘要

PURPOSE: A bonding pad of a semiconductor chip reducing the damage possibility is provided to reduce the possibility of damage when wire bonding is performed by setting a bonding preservation region in a circle or a round ring. CONSTITUTION: The first metal wiring layer(220) is formed on an upper part of the silicon substrate. The second metal wiring layer(230) is formed on upper part of the first metal wiring layer. The second metal wiring layer's one part is exposed for the wire bonding and a bonding pad area is formed. An inter-layer insulating film(240) is formed between the first metal wiring layer and the second metal wiring layer.