发明名称 Light emitting device and method of fabricating the same
摘要 A composite growth-assisting substrate 10 is formed by epitaxially growing a separation-assisting compound semiconductor layer 10k composed of a non-GaAs III-V compound semiconductor single crystal, and then a sub-substrate 10e composed of a GaAs single crystal in this order, on a first main surface of a substrate bulk 10m composed of a GaAs single crystal. The sub-substrate portion 10e is then separated from the composite growth-assisting substrate 10, so as to be left as a residual substrate portion 1 on a second main surface of the main compound semiconductor layer 40, and a portion of the residual substrate portion 1 is cut off to thereby form a cut-off portion 1j having a bottom surface used as a light extraction surface. By this configuration, the light emitting device is provided as allowing effective use of the GaAs substrate, and increasing the light extraction efficiency.
申请公布号 US7972892(B2) 申请公布日期 2011.07.05
申请号 US20050590325 申请日期 2005.02.25
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 YAMADA MASATO;TAKAHASHI MASANOBU
分类号 H01L21/00;H01L33/10;H01L33/30;H01L33/40;H01L33/62;H01S5/323 主分类号 H01L21/00
代理机构 代理人
主权项
地址