ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND DIE ATTACH FILM

摘要

An adhesive composition for a semiconductor device and a die attach film for a semiconductor device, the adhesive composition including about 50 to about 80 parts by weight of an elastomeric resin; about 10 to about 20 parts by weight of an epoxy resin, the epoxy resin including a difunctional epoxy resin and polyfunctional epoxy resins and the difunctional epoxy resin being present in an amount of about 20 to about 60 parts by weight with respect to 100 parts by weight of the epoxy resin; about 1 to about 10 parts by weight of a curable resin; about 0.01 to about 10 parts by weight of a curing accelerator; about 0.01 to about 10 parts by weight of a silane coupling agent; and about 5 to about 10 parts by weight of a filler.