发明名称 BOARD FOR SEALED SYSTEM AND RADIATION HEAT STRUCTURE FOR THE SAME
摘要 PURPOSE: A board of a closed system and a radiation heat structure thereof are provided to secure reliability for heat under the environment condition of a high temperature by effectively radiating heat based on direct contact of a whole thermal pad and a coolant passage. CONSTITUTION: A heating board(310) comprises heat sources. A thermal pad(315) is contacted with a radiation heat contact surface of a housing(316). A conducing plate(314) is unified in the heat sources and is laminated in the thermal pad. The thermal pad is contacted with the housing by transferring a motherboard with the heating board through the extension of an edge lock. The edge lock fixes the heating board in the housing. A shape of the housing makes directly contacts the thermal pad to the coolant passage of the housing.
申请公布号 KR101045342(B1) 申请公布日期 2011.06.30
申请号 KR20100023864 申请日期 2010.03.17
申请人 LIG NEX1 CO., LTD. 发明人 PARK, SUK HWAN
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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